Copper Electroplating Utility Systems

The Copper Electroplating Process is also an important process for semiconductor manufacturing. We support chemical utility of Copper Electroplating Equipment.

Chemical Supply System

This system supplies electroplating solution from 200L drum to Copper Electroplating Equipment and Analyzer.

Chemical Supply System

Specification

Dimension W2000×D1000×H2000
Distribution Capacity 15L/min X 2 lines @ 0.4MPa

Function

Drum Cabinet Capacity : one 200L drum
Pressure Vessel ・Legally Approved
・Capacity: 100L (gross weight: approx. 130Kg)
・Maximum Capable Pressure: 0.45MPa

Chemical Recovery System

This system recovers electroplating solution drained from Copper Electroplating Equipment and Analyzer to 200L drum.

Specification

Dimension W2000×D1000×H2000

Function

Drum Cabinet ・Capacity : two 200L drums
・Function : a) Auto switchover between two drums

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